Taiwanese chipset maker MediaTek has just introduced three new SoCs aimed at the mid-tier market: Dimensity 1050, Dimensity 930 and Helio G99. The most interesting is the Dimensity 1050 because it offers mmWave 5G support, one of the networks that Verizon mainly uses in the United States.
More importantly, the new Dimensity 1050 chipset is manufactured by TSMC on a 6nm process. While that means it’s one of the smallest smartphone chipsets, it retains the same performance and power consumption as the chipsets built using the 7nm process.
In terms of specifications, the Dimension 1050 chipsets house an octa-core CPU consisting of two Cortex-A78 cores clocked at 2.5GHz and six Cortex-A55 cores operating at 2.0GHz, as well as a Mali-G610 MC3 graphics processing unit (GPU).
It’s also important to add that MediaTek’s Dimensity 1050 SoC can switch seamlessly between sub-6GHz and blazing-fast, long-range mmWave 5G connections. In addition, the chipset can connect to both at the same time, delivering up to 53% faster speeds than other chipsets that can only connect to 4G LTE and mmWave simultaneously.
Finally, the Dimensity 1050 supports FHD+ display up to a 144Hz refresh rate, native 10-bit color HDR support, as well as HDR10+ Adaptive and Dolby Vision. MediaTek also confirmed that the handset maker can build multi-camera smartphones with main cameras up to 108MP. Thanks to the Imagiq 760 HDR-IPS, smartphones equipped with Dimensity 1050 chipsets will benefit from support for dual HDR video recording (it can record on two cameras simultaneously).
According to MediaTek, the first smartphones powered by the new Dimensity 1050 chipsets will arrive sometime in the third quarter of 2022.